Qualcomm has announced the Snapdragon Sound Elite Gen 2, a sound‑processing chip that embeds micro‑power Wi‑Fi 6E directly into the silicon. The integration allows wireless earbuds and audio‑glass devices to connect straight to a home Wi‑Fi network and, through that link, to cloud‑based audio sources. By bypassing the need for a nearby phone, the chip aims to deliver continuous, high‑quality lossless audio even when the source device is out of range.
Integrated Wi‑Fi 6E eliminates extra hardware
The new Elite chip marks a shift from Qualcomm’s earlier approach, which required a separate Wi‑Fi module to achieve the same capability. In 2023, the company introduced the S7 Pro sound platform with Expanded Personal Area Network (XPAN) technology, promising Wi‑Fi‑enabled earbuds that could handle 24‑bit, 96 kHz lossless audio—far beyond Bluetooth’s bandwidth limits. However, that platform relied on an additional Wi‑Fi chip, a factor that limited adoption among manufacturers of very small devices. Only one product, Xiaomi’s 2025 Buds 5 Pro, was ever reported to use the earlier platform, and it never received a global launch.
By embedding Wi‑Fi 6E within the Snapdragon Sound Elite Gen 2, Qualcomm removes the need for a second chip, simplifying design and potentially accelerating market uptake. The integrated solution enables earbuds to stream lossless audio directly over Wi‑Fi, a capability previously described as the “Wi‑Fi earbud dream.”
Power efficiency and AI upgrades
Qualcomm highlights three key improvements over the previous generation. First, the chip is 30 percent smaller, a reduction that can free up valuable space inside compact earbud housings. Second, power consumption is lowered by up to 40 percent, extending battery life for devices that must balance high‑fidelity audio with limited energy reserves. Third, the new silicon doubles the AI processing power available to “intelligent hearables,” a term Qualcomm uses for earbuds that incorporate artificial‑intelligence features.
The AI capabilities are intended to support advanced functions such as adaptive sound tuning, voice assistance, and other context‑aware features. Qualcomm’s messaging suggests that the combination of lower power draw and stronger AI processing could make the chip attractive to manufacturers seeking to differentiate their products with smarter, more capable audio experiences.
Industry partnerships signal early adoption
Qualcomm says it is already collaborating with several major audio and computing brands to bring the Elite chip to market. The company is working with HP on an unnamed product, indicating that laptop or headset manufacturers may integrate the technology beyond traditional earbuds. Qualcomm also reports a close partnership with Bose, a well‑known audio brand, and a pioneering effort with Cleer to create a new category of “intelligent hearables” that include built‑in cameras.
These collaborations suggest that Qualcomm is positioning the Snapdragon Sound Elite Gen 2 as a foundational component for next‑generation wearable audio devices. By offering a single‑chip solution that merges Wi‑Fi connectivity, lossless audio support, reduced power consumption, and enhanced AI processing, the company hopes to overcome the adoption hurdles that limited its earlier XPAN‑based platform.
While no specific product timelines have been disclosed, the announced partnerships and technical specifications indicate that Qualcomm expects the Elite chip to enable manufacturers to launch Wi‑Fi‑enabled earbuds and audio glasses that can stream high‑resolution audio without the constraints of Bluetooth. If successful, the integration could reshape consumer expectations for wireless audio quality and functionality.
Norman Pearlstine is the Executive Editor and Co-Founder at News Raise. With over two decades of experience across financial journalism, corporate governance, and market analysis, Norman leads the editorial direction and ensures strict adherence to journalistic accuracy and ethics.
